Lumentum teams with Qualcomm, Corning for optical die-to-die interconnect demo at ECOC 2026

• Lumentum plans a joint ECOC 2026 demonstration with Qualcomm Technologies, Corning on high-density optical die-to-die connectivity for AI scale-up.
• Board-level showcase targets co-packaged optics, near-packaged optics using emerging interfaces such as UCIe over multimode fiber spanning tens of meters.
• Proof-of-concept uses 32 Gb/s NRZ optical channels; design targets about 1 Tb/s/mm shoreline bandwidth density, scaling toward about 4 Tb/s/mm.
• Lumentum contributes a 1060 nm VCSEL optical engine with about 10 Tb/s aggregate transmit-receive capacity, using dense VCSEL-photodetector arrays.
• Corning supplies high-density multimode fiber glass ferrules; Qualcomm provides the die-to-die interface IP subsystem for direct-drive optical connectivity.

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