-+ 0.00%
-+ 0.00%
-+ 0.00%

LG Electronics showcases modular AI data center cooling at Data Center World Asia 2026

PUBT·09/29/2026 01:07:03
LG Electronics showcases modular AI data center cooling at Data Center World Asia 2026
  • LG Electronics showcased modular cooling infrastructure for AI data centers at Data Center World Asia 2026, which opened July 29 in Singapore.
  • Prefabricated containerized “hydronic modular” units aim to cut build times and upfront capex for hyperscale AI data center projects.
  • Exhibit highlighted liquid-cooling expansion, including 1 MW and 2.6 MW CDUs qualified to Nvidia specifications for direct-to-chip deployments.
  • Group offering positioned a broader “One LG” package spanning cooling, power storage, design, construction, operations, and modular data centers.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. LG Corp. published the original content used to generate this news brief on September 29, 2026, and is solely responsible for the information contained therein.