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Applied Materials, Intel Partnering Over Development Of Chipmaking Innovations For Transistors, Interconnects, Packing Technologies

Benzinga·10/06/2026 13:04:22

Applied Materials, Inc. (Nasdaq: AMAT), the leader in materials engineering for the semiconductor industry, today announced it is working with Intel Corporation (NASDAQ:INTC) to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies. The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon to shorten time-to-market of advanced semiconductor technologies essential to AI computing.