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UPM showcases starch-based paper packaging at PACK EXPO

PUBT·10/20/2026 11:10:08
UPM showcases starch-based paper packaging at PACK EXPO
  • UPM will showcase paper-based packaging developed with Ingredion and Paramelt at PACK EXPO in Chicago, October 18-21.
  • The jointly developed packaging structure passed Part 1 recyclability testing at Western Michigan University.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. UPM-Kymmene Oyj published the original content used to generate this news brief on October 20, 2026, and is solely responsible for the information contained therein.