NVIDIA And Amkor Plan To Expand Advanced Packaging Capacity In South Korea, Targeting Greater Than 300% Increase In Interposer Wafer Capacity By End Of 2028

Scaling Advanced Packaging for Next-Generation Platforms

NVIDIA and Amkor plan to expand advanced packaging capacity in South Korea, targeting a greater than 300% increase in interposer wafer capacity by the end of 2028. The planned capacity expansion, alongside Amkor’s development of new manufacturing facilities in South Korea, will support higher production volumes for NVIDIA’s current and next-generation platforms.