“Certain Measures to Promote the Development of the Integrated Circuit Industry in Xiamen” was publicly solicited for comments. Among them, it was mentioned that enterprises engaged in the development of core equipment to support integrated circuit manufacturing and sealing and testing will be given an annual subsidy of up to 10 million yuan according to no more than 30% of the enterprise's core equipment R&D expenses. Support key material research. Enterprises engaged in the development of key materials that support integrated circuit manufacturing and encapsulation, such as lithography materials, encapsulation boards, and wide bandgap semiconductor materials, are given an annual subsidy of up to 5 million yuan at an annual subsidy of up to 30% of the enterprise's key material R&D expenses; for the urgent needs of strategic emerging industries such as artificial intelligence, new storage, computing power infrastructure, low-altitude communications, 6th generation mobile communications, and new energy sources, they carry out high-performance chip manufacturing, new storage technology research and development, and advanced/characteristic packaging technology research and development according to no more than the enterprise's advanced/characteristic packaging and new storage processes A maximum annual subsidy of 5 million yuan is granted for 30% of the R&D expenses of advanced manufacturing processes.

“Certain Measures to Promote the Development of the Integrated Circuit Industry in Xiamen” was publicly solicited for comments. Among them, it was mentioned that enterprises engaged in the development of core equipment to support integrated circuit manufacturing and sealing and testing will be given an annual subsidy of up to 10 million yuan according to no more than 30% of the enterprise's core equipment R&D expenses. Support key material research. Enterprises engaged in the development of key materials that support integrated circuit manufacturing and encapsulation, such as lithography materials, encapsulation boards, and wide bandgap semiconductor materials, are given an annual subsidy of up to 5 million yuan at an annual subsidy of up to 30% of the enterprise's key material R&D expenses; for the urgent needs of strategic emerging industries such as artificial intelligence, new storage, computing power infrastructure, low-altitude communications, 6th generation mobile communications, and new energy sources, they carry out high-performance chip manufacturing, new storage technology research and development, and advanced/characteristic packaging technology research and development according to no more than the enterprise's advanced/characteristic packaging and new storage processes A maximum annual subsidy of 5 million yuan is granted for 30% of the R&D expenses of advanced manufacturing processes.