Jinfu Technology said in a conference call that the company's liquid cooling business is mainly carried out through the holding subsidiary Changshu Minglijia Metal Products Co., Ltd. The products are the core components of cold plate liquid cooling modules, which are mainly used in HGX server structures corresponding to B-series chips. At present, the company's full production capacity has been completed, and a new round of production expansion is expected to be put into operation before the Spring Festival. Rubin Ultra is widely regarded by the market as a next-generation high-end AI platform, and its cooling solution is expected to be upgraded from module level to package level liquid cooling. The company has participated in related pre-testing and sample delivery work, and has obtained small orders for customer trial production verification. The platform is still in the design and verification stage, and the pace of mass production depends on how the upstream platform progresses.

Jinfu Technology said in a conference call that the company's liquid cooling business is mainly carried out through the holding subsidiary Changshu Minglijia Metal Products Co., Ltd. The products are the core components of cold plate liquid cooling modules, which are mainly used in HGX server structures corresponding to B-series chips. At present, the company's full production capacity has been completed, and a new round of production expansion is expected to be put into operation before the Spring Festival. Rubin Ultra is widely regarded by the market as a next-generation high-end AI platform, and its cooling solution is expected to be upgraded from module level to package level liquid cooling. The company has participated in related pre-testing and sample delivery work, and has obtained small orders for customer trial production verification. The platform is still in the design and verification stage, and the pace of mass production depends on how the upstream platform progresses.