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TTM Technologies invests $130 million in Ultra-HDI PCB plant expansion in Syracuse, New York

PUBT·06/22/2026 20:01:23
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TTM Technologies invests $130 million in Ultra-HDI PCB plant expansion in Syracuse, New York
  • TTM Technologies opened a 215,000-square-foot Ultra-HDI PCB manufacturing facility in Syracuse, New York, expanding domestic capacity for advanced defense electronics.
  • Total investment reached USD 130 million, including USD 30 million from the U.S. Department of War.
  • Project targets up to 400 new engineering and manufacturing jobs, lifting the company’s Central New York workforce to about 1,000.
  • Facility is designed for Ultra-HDI boards and advanced packaging used in next-generation radar, missile defense, space, and autonomous systems.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. TTM Technologies Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202606221601PRIMZONEFULLFEED9750660) on June 22, 2026, and is solely responsible for the information contained therein.