According to the CICC research report, proximal heat dissipation and liquid cooling form a complementary system. Currently, the power consumption of the H100, Blackwell, and Rubin series GPUs continues to break through the kilowatt level. 3D packaging further boosts the local heat flow of the chip, and the thermal conductivity bottleneck of copper and aluminum materials is prominent; diamond has high thermal conductivity and low thermal expansion coefficient of 2000W/mK, which can quickly flatten chip hot spots. At the industrial implementation level, diamond is responsible for uniform heat diffusion at the proximal end of the chip, and liquid cooling is responsible for cabinet system-level heat dissipation. The two are not an alternative relationship. In the future, high-end AI servers are expected to use a “diamond heat sinking+full liquid cooling” composite cooling scheme.

According to the CICC research report, proximal heat dissipation and liquid cooling form a complementary system. Currently, the power consumption of the H100, Blackwell, and Rubin series GPUs continues to break through the kilowatt level. 3D packaging further boosts the local heat flow of the chip, and the thermal conductivity bottleneck of copper and aluminum materials is prominent; diamond has high thermal conductivity and low thermal expansion coefficient of 2000W/mK, which can quickly flatten chip hot spots. At the industrial implementation level, diamond is responsible for uniform heat diffusion at the proximal end of the chip, and liquid cooling is responsible for cabinet system-level heat dissipation. The two are not an alternative relationship. In the future, high-end AI servers are expected to use a “diamond heat sinking+full liquid cooling” composite cooling scheme.