According to reports, in order to solve power consumption and heat dissipation issues, Samsung is focusing on developing “2.xD” packaging technology. According to the introduction, 2.xD will develop into a high-capacity, high-bandwidth system package for artificial intelligence data centers by integrating HBM, logic chips, and silicon photonic technology into a single system by applying a panel-based redistribution layer intermediary layer on the basis of the existing package based on the silicon intermediate layer.

According to reports, in order to solve power consumption and heat dissipation issues, Samsung is focusing on developing “2.xD” packaging technology. According to the introduction, 2.xD will develop into a high-capacity, high-bandwidth system package for artificial intelligence data centers by integrating HBM, logic chips, and silicon photonic technology into a single system by applying a panel-based redistribution layer intermediary layer on the basis of the existing package based on the silicon intermediate layer.