According to Qipai Technology's announcement, the company plans to issue A-shares to specific targets through a simple procedure, raising a total capital of 110 million yuan. After deducting issuance fees, the net amount will be used for “high-density high-performance chip sealing and testing projects.” The construction site of the project is located in Dongguan. The construction period is 3 years. After completion, it will add a production capacity of 514 million units/year for packaging testing. The project is based on considerations such as rising demand in the semiconductor industry and breaking through production capacity bottlenecks. The company has good market prospects. The company has an implementation foundation in terms of production organization, technology and talent, and the industry where the project is located is in the field of scientific and technological innovation, which helps enhance the company's scientific and technological innovation capabilities.

According to Qipai Technology's announcement, the company plans to issue A-shares to specific targets through a simple procedure, raising a total capital of 110 million yuan. After deducting issuance fees, the net amount will be used for “high-density high-performance chip sealing and testing projects.” The construction site of the project is located in Dongguan. The construction period is 3 years. After completion, it will add a production capacity of 514 million units/year for packaging testing. The project is based on considerations such as rising demand in the semiconductor industry and breaking through production capacity bottlenecks. The company has good market prospects. The company has an implementation foundation in terms of production organization, technology and talent, and the industry where the project is located is in the field of scientific and technological innovation, which helps enhance the company's scientific and technological innovation capabilities.