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Suiyuan Technology and ZTE released the Yunsui ESL64-O supernode, using a self-developed AI chip to achieve 0 cables through an OEX orthogonal backplane design, greatly reducing interconnection costs. In addition, Suiyuan Technology and Xianfeng Technology also released advanced CoPos panel-level packaging samples compatible with AI computing power chips.

Zhitongcaijing·07/19/2026 05:09:01
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Suiyuan Technology and ZTE released the Yunsui ESL64-O supernode, using a self-developed AI chip to achieve 0 cables through an OEX orthogonal backplane design, greatly reducing interconnection costs. In addition, Suiyuan Technology and Xianfeng Technology also released advanced CoPos panel-level packaging samples compatible with AI computing power chips.