According to the Zhitong Finance App, Lansi Technology (300433.SZ) announced that Lansi International (Hong Kong) Co., Ltd., a wholly-owned subsidiary of the company, recently signed a memorandum of cooperation with Intel Corporation (hereinafter referred to as “Intel”). The two sides regard TGV advanced packaging as the key direction of discussions under this Memorandum of Understanding, and Intel sees Lansi Technology as a valuable potential partner in this field. The two sides will discuss and evaluate potential collaborations related to key processes such as glass substrate drilling, high-precision laser processing, metallized through-hole deposition, and multi-layer interconnect wiring, and Intel will provide illustrative architecture information, manufacturability design (DFM) guidelines, benchmark testing methods, and verification methods.

According to the Zhitong Finance App, Lansi Technology (300433.SZ) announced that Lansi International (Hong Kong) Co., Ltd., a wholly-owned subsidiary of the company, recently signed a memorandum of cooperation with Intel Corporation (hereinafter referred to as “Intel”). The two sides regard TGV advanced packaging as the key direction of discussions under this Memorandum of Understanding, and Intel sees Lansi Technology as a valuable potential partner in this field. The two sides will discuss and evaluate potential collaborations related to key processes such as glass substrate drilling, high-precision laser processing, metallized through-hole deposition, and multi-layer interconnect wiring, and Intel will provide illustrative architecture information, manufacturability design (DFM) guidelines, benchmark testing methods, and verification methods.