Basic Semiconductor signs EPC contract worth RMB 193.3 million for SiC module packaging base construction

• Basic Semiconductor signed an EPC contract to build a silicon carbide module packaging production line base in Shenzhen for RMB 193.3 million.
• Project covers 59,357.54 square meters across two buildings, including production facilities and supporting uses.
• Funding planned from internal resources plus bank loans; 20% advance payment due on signing.
• Counterparty China Construction Second Engineering Bureau, a unit of China State Construction Engineering, selected via public tender.
• Deal classified as a discloseable transaction under Hong Kong listing rules, with no shareholder vote required.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Basic Semiconductor Co. Ltd. published the original content used to generate this news brief via IIS, the regulatory disclosure system operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260728-12258146), on July 27, 2026, and is solely responsible for the information contained therein.