According to the Shanghai Securities News, domestic TGV glass substrates are currently being mass-produced at an accelerated pace. Domestic pilot production lines have been verified, and leading companies have stepped up their layouts one after another to seize new opportunities for advanced semiconductor packaging in the AI era. As the core underlying technology for next-generation semiconductor advanced packaging, TGV glass through-hole technology has the core advantages of low loss, high precision, and high stability. It can perfectly adapt to the strict packaging requirements of AI computing power chips and high-end chips, and is currently the core mainstream direction of iterative upgrading of new semiconductor materials. With the rapid explosion of the global AI computing power industry, the transmission efficiency, accuracy and stability requirements of high-end chips for packaging substrates continue to upgrade. The industrialization value of TGV technology is prominent, and there is broad room for market growth. According to enterprise survey data, as of July 28, there are currently 5,281 domestic enterprises related to glass substrates. Judging from the operating time, most of the relevant enterprises are mature enterprises, and 60.55% of enterprises have been established for more than 10 years. Judging from the distribution of registered capital, most of the relevant enterprises are capital-intensive enterprises, with a registered capital of 50 million yuan or more accounting for 41.28%. Judging from the regional distribution, companies related to glass substrates have a strong geographical concentration. The East China region accounts for 44.14% of the enterprise stock, and the South China region accounts for 29.99%. Together, the two major regions exceed 74%.

According to the Shanghai Securities News, domestic TGV glass substrates are currently being mass-produced at an accelerated pace. Domestic pilot production lines have been verified, and leading companies have stepped up their layouts one after another to seize new opportunities for advanced semiconductor packaging in the AI era. As the core underlying technology for next-generation semiconductor advanced packaging, TGV glass through-hole technology has the core advantages of low loss, high precision, and high stability. It can perfectly adapt to the strict packaging requirements of AI computing power chips and high-end chips, and is currently the core mainstream direction of iterative upgrading of new semiconductor materials. With the rapid explosion of the global AI computing power industry, the transmission efficiency, accuracy and stability requirements of high-end chips for packaging substrates continue to upgrade. The industrialization value of TGV technology is prominent, and there is broad room for market growth. According to enterprise survey data, as of July 28, there are currently 5,281 domestic enterprises related to glass substrates. Judging from the operating time, most of the relevant enterprises are mature enterprises, and 60.55% of enterprises have been established for more than 10 years. Judging from the distribution of registered capital, most of the relevant enterprises are capital-intensive enterprises, with a registered capital of 50 million yuan or more accounting for 41.28%. Judging from the regional distribution, companies related to glass substrates have a strong geographical concentration. The East China region accounts for 44.14% of the enterprise stock, and the South China region accounts for 29.99%. Together, the two major regions exceed 74%.