The US Department of Commerce announced on July 29 that it has signed letters of intent with 7 companies under the “Chip and Science Act” to provide a total federal incentive fund of 874 million US dollars to support semiconductor research and development in the fields of integrated photonics, computing architectures, advanced packaging, substrates, materials, and storage.

The US Department of Commerce announced on July 29 that it has signed letters of intent with 7 companies under the “Chip and Science Act” to provide a total federal incentive fund of 874 million US dollars to support semiconductor research and development in the fields of integrated photonics, computing architectures, advanced packaging, substrates, materials, and storage.