Suzhou Tianmai (301626.SZ) plans to acquire a controlling interest in Intercooling Technology to expand the high and low temperature intelligent equipment business in the pan-semiconductor field

According to Zhitong Finance App, Suzhou Tianmai (301626.SZ) announced that the company plans to acquire 100% of the shares of Hainan Siyang Investment Co., Ltd. (hereinafter referred to as “Hainan Siyang”) in cash, thereby indirectly holding 56.6750% of the shares of Chengdu Intercooling Cryogenic Technology Co., Ltd. (hereinafter referred to as “Intercooling Technology”), and to include Intercooling Technology in the scope of the company's consolidated statements.

In the process of this acquisition, COLeng Technology plans to introduce other investors through capital increase and share expansion. After the capital increase is completed, the other investors will hold 10% of COOLING Technology's shares. After Intercooling Technology introduces other investors, the company's indirect shareholding of COOLING Technology through Hainan Siyang will be changed to 51.00%, and COREG Technology will still be included in the scope of the company's consolidated statements.

Intercooling Technology is mainly engaged in research and industrialization of refrigeration and engineering thermophysics related technologies, focusing on high and low temperature intelligent equipment in the field of pan-semiconductors. Intercooling Technology mainly produces three-temperature liquid coolers (Chillers), gas chillers (GasChillers), contact high and low temperature impact machines (ATC/TCU), immersion liquid cooling systems, ultra-low temperature chillers, etc., to provide a complete set of temperature environment solutions for the fields of chips, optical communications, automotive electronics, integrated circuits, flat panel displays, vacuum coating, etc.

After the completion of this transaction, Intercooling Technology's refrigeration and engineering thermophysics-related technology and the company's thermal management technology complement each other, extend the company's thermal management industry chain, expand the high and low temperature intelligent equipment business in the pan-semiconductor field, further enrich the company's product matrix, enhance the company's overall thermal management solution capabilities, and expand new business growth points.