Tesla officially announced that its large-scale chip manufacturing project codenamed “Terafab” will be located in Grimes County, Texas, USA. The project is co-led by Tesla, SpaceX, and xAI to build the world's largest semiconductor manufacturing facility to meet the growing computing power needs of its companies in the fields of artificial intelligence, autonomous driving, and space missions. erafab is not a foundry in the traditional sense, but an advanced semiconductor fab with a high degree of vertical integration. Tesla made it clear that the project integrates logic chips, memory chips, advanced packaging and testing in the same facility, and the manufacturing area is planned to exceed 100 million square feet. This full-process closed-loop design aims to enable rapid iteration of chips from design to mass production, and accelerate the deployment of new computing capabilities. In terms of capacity planning, Terafab has set a very ambitious goal: annual production capacity exceeding 1 terawatt of computing capacity. This scale is about 50 times the current annual global chip production capacity, far exceeding the supply growth rate of existing suppliers. Tesla pointed out that although existing chip suppliers are expanding production capacity, their expansion rate is still unable to meet the exponential growth in demand from Tesla and SpaceX in the fields of robotics, autonomous driving, and AI data centers.

Tesla officially announced that its large-scale chip manufacturing project codenamed “Terafab” will be located in Grimes County, Texas, USA. The project is co-led by Tesla, SpaceX, and xAI to build the world's largest semiconductor manufacturing facility to meet the growing computing power needs of its companies in the fields of artificial intelligence, autonomous driving, and space missions. erafab is not a foundry in the traditional sense, but rather an advanced semiconductor fab with a high degree of vertical integration. Tesla made it clear that the project integrates logic chips, memory chips, advanced packaging and testing in the same facility, and the manufacturing area is planned to exceed 100 million square feet. This full-process closed-loop design aims to enable rapid iteration of chips from design to mass production, and accelerate the deployment of new computing capabilities. In terms of capacity planning, Terafab has set a very ambitious goal: annual production capacity exceeding 1 terawatt of computing capacity. This scale is about 50 times the current annual global chip production capacity, far exceeding the supply growth rate of existing suppliers. Tesla pointed out that although existing chip suppliers are expanding production capacity, their expansion rate is still unable to meet the exponential growth in demand from Tesla and SpaceX in the fields of robotics, autonomous driving, and AI data centers.