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MetaOptics expands U.S. footprint with planned 12-inch DUV immersion fab line

PUBT·08/07/2026 14:12:00
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MetaOptics expands U.S. footprint with planned 12-inch DUV immersion fab line
  • MetaOptics deferred its Nasdaq dual listing, pivoting capital toward scaling U.S. metalens manufacturing and fulfilling equipment orders.
  • Plans include establishing its first U.S. front-end semiconductor fabrication line with 12-inch DUV immersion lithography equipment.
  • A Direct Laser Writer deployment at the University of Arizona’s Center of Semiconductor Manufacturing is slated to start installation in 2027.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Metaoptics Ltd. published the original content used to generate this news brief via Singapore Exchange Limited (SGX) (Ref. ID: 95H5964EHNY9TL4H) on August 07, 2026, and is solely responsible for the information contained therein.