Xinhenghui announced that the company plans to use part of the initial public offering of over capital of 888.16,500 yuan and 42.1835 million yuan of its own capital to invest 130 million yuan to build an etched lead frame production workshop expansion and IoT eSIM chip encapsulation and production expansion project. The construction period of the project is 16 months. The IoT eSIM chip packaging, testing and production expansion sub-project achieved annual revenue of 22 million yuan and net profit of 5.6876 million yuan. The matter has been reviewed by the Board of Directors and Audit Committee, and still needs to be reviewed by the Shareholders' Meeting.

Xinhenghui announced that the company plans to use part of the initial public offering of over capital of 888.16,500 yuan and 42.1835 million yuan of its own capital to invest 130 million yuan to build an etched lead frame production workshop expansion and IoT eSIM chip encapsulation and production expansion project. The construction period of the project is 16 months. The IoT eSIM chip packaging, testing and production expansion sub-project achieved annual revenue of 22 million yuan and net profit of 5.6876 million yuan. The matter has been reviewed by the Board of Directors and Audit Committee, and still needs to be reviewed by the Shareholders' Meeting.