Baoding Technology (002552.SZ): Ultra low profile copper foil HVLP is currently still in the customer certification and market expansion stage and is not included in the AI server supply chain system certification

Zhitong Finance App News, Baoding Technology (002552.SZ) issued an announcement. The cumulative deviation value of the closing price increase of the company's stock exceeded 20% for 3 consecutive trading days on August 7, August 10, and August 11, 2026. According to the relevant provisions of the “Shenzhen Stock Exchange Trading Rules”, this is an abnormal fluctuation in stock trading. The company's products have not been certified by Nvidia's supply chain system. Up to now, the company has had no contact with Nvidia, nor has it carried out any kind of business cooperation with it.

The company's copper-clad plate products are mainly conventional products such as FR-4 and composite panels. There is no AI copper-clad plate, no application in the field of AI servers or computing power. Currently, there is no high speed copper clad plate M7 and M9 product sales, no related orders or revenue. Among them, M7 is still in the customer certification stage, does not involve overseas customers, and there is significant uncertainty about whether it can pass customer certification; M9 is in the early R&D stage, and there is no corresponding sample.

The company's electronic copper foil is mainly HTE high-temperature and high-extensibility electrolytic copper foil. It is a general standard product. It cannot be used in the field of AI servers and computing power, and the product gross margin is low. The ultra-low profile copper foil HVLP is currently still in the customer certification and market expansion stage. It has not been incorporated into the AI server supply chain system certification, mass production has not been formed, and there are no production expansion plans. There is great uncertainty about future order acquisition and business development.