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The Zhitong Finance App learned that according to TrendForce Jibang Consulting's latest AI server industry research, under the wave of AI infrastructure construction, AI chips led by NVIDIA, AMD, and Google continue to iterate. The thermal design power consumption (TDP) of a single chip has generally exceeded 1 kW. The power of the full-cabinet AI server solution has climbed to hundreds of kW, and liquid cooling has gradually become a standard configuration for high-end AI infrastructure. TrendForce Jibang Consulting estimates that the penetration rate of liquid cooling in AI chips will reach 53% in 2026, and is expected to approach 60% in 2027.

Zhitongcaijing·08/17/2026 06:41:08
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The Zhitong Finance App learned that according to TrendForce Jibang Consulting's latest AI server industry research, under the wave of AI infrastructure construction, AI chips led by NVIDIA, AMD, and Google continue to iterate. The thermal design power consumption (TDP) of a single chip has generally exceeded 1 kW. The power of the full-cabinet AI server solution has climbed to hundreds of kW, and liquid cooling has gradually become a standard configuration for high-end AI infrastructure. TrendForce Jibang Consulting estimates that the penetration rate of liquid cooling in AI chips will reach 53% in 2026, and is expected to approach 60% in 2027.