As semi-annual reports were released one after another, the report cards of domestic CMP companies represented by Dinglong Co., Ltd. attracted attention. The launch of Changxin Technology has further multiplied confidence in the transformation of memory chip technology routes. As one of the key processes in integrated circuit manufacturing, CMP stands at a new cusp. The reporter learned from research that the evolution of wafer manufacturing to high density and 3D has directly driven polishing steps and the frequency of consumables replacement, and the market elasticity of CMP materials has been greatly unleashed. Driven by the growth in demand in the local supply chain and the wave of domestic substitution, this key process link is ushering in unprecedented development opportunities.

As semi-annual reports were released one after another, the report cards of domestic CMP companies represented by Dinglong Co., Ltd. attracted attention. The launch of Changxin Technology has further multiplied confidence in the transformation of memory chip technology routes. As one of the key processes in integrated circuit manufacturing, CMP stands at a new cusp. The reporter learned from research that the evolution of wafer manufacturing to high density and 3D has directly driven polishing steps and the frequency of consumables replacement, and the market elasticity of CMP materials has been greatly unleashed. Driven by the growth in demand in the local supply chain and the wave of domestic substitution, this key process link is ushering in unprecedented development opportunities.