The Shanghai Science and Technology Commission issued the “15th Five-Year Plan for the Development of the Shanghai Zhangjiang High-tech Industrial Development Zone”. Among them, it is proposed to focus on key links in the industrial chain such as high-end chip design, process manufacturing, core equipment and materials, strengthen industrial collaboration around the construction of an “integrated two-wing” core area, and build a leading integrated circuit industrial cluster. High-end chip design supports the construction of advanced packaging technology systems such as electronic design automation tools and intelligent upgrades, and accelerates the construction of electronic design automation and integrated circuit design module innovation centers and fifth-generation command set innovation centers. Process manufacturing focuses on promoting the construction of a number of major industrialization projects and building a process platform. Core equipment and materials, accelerate the construction of high-end semiconductor equipment demonstration parks, promote R&D and industrialization of key equipment such as integrated circuit testing equipment and advanced packaging equipment, and accelerate technology research and industrialization of third-generation and fourth-generation semiconductor materials.

The Shanghai Science and Technology Commission issued the “15th Five-Year Plan for the Development of the Shanghai Zhangjiang High-tech Industrial Development Zone”. Among them, it is proposed to focus on key links in the industrial chain such as high-end chip design, process manufacturing, core equipment and materials, strengthen industrial collaboration around the construction of an “integrated two-wing” core area, and build a leading integrated circuit industrial cluster. High-end chip design supports the construction of advanced packaging technology systems such as electronic design automation tools and intelligent upgrades, and accelerates the construction of electronic design automation and integrated circuit design module innovation centers and fifth-generation command set innovation centers. Process manufacturing focuses on promoting the construction of a number of major industrialization projects and building a process platform. Core equipment and materials, accelerate the construction of high-end semiconductor equipment demonstration parks, promote R&D and industrialization of key equipment such as integrated circuit testing equipment and advanced packaging equipment, and accelerate technology research and industrialization of third-generation and fourth-generation semiconductor materials.