There is no shortage of highlights at this year's end-side AI chip circuit. A-share chip manufacturers collectively reported good news for the first half of the year. Among them, the financial report released by Quanzhi Technology on the evening of August 25 showed that operating income and net profit for the first half of the year increased by 41.23% and 204.17%, respectively. Previously, Rockchip revealed that net profit for the first half of the year increased 61.73% year on year; Fuhanwei expected net profit for the first half of the year to increase 1072.2% to 1420.19% year on year. At the technical level, end-side AI chip manufacturers such as Guangyu Xinchen and Houmo Smart are betting on technologies such as 3D stacking and integrated storage and calculation, with the intention of breaking through the “memory wall.” Zhang Xiaorong, director of the Deepin Science and Technology Research Institute, recently told reporters that 2026 is regarded by the industry as the “first year of commercialization of end-side AI” and is expected to begin in 2027. The advantages of domestic end-side AI chip manufacturers are large markets, multiple scenarios, and flexibility in style of play. Future breakers will not only rely on innovative architectures such as 3D stacking to resolve power consumption and computing power conflicts, but also bind downstream applications more tightly and use scene depth in exchange for ecological depth to seize the opportunities for localization of end-side computing power.

There is no shortage of highlights at this year's end-side AI chip circuit. A-share chip manufacturers collectively reported good news for the first half of the year. Among them, the financial report released by Quanzhi Technology on the evening of August 25 showed that operating income and net profit for the first half of the year increased by 41.23% and 204.17%, respectively. Previously, Rockchip revealed that net profit for the first half of the year increased 61.73% year on year; Fuhanwei expected net profit for the first half of the year to increase 1072.2% to 1420.19% year on year. At the technical level, end-side AI chip manufacturers such as Guangyu Xinchen and Houmo Smart are betting on technologies such as 3D stacking and integrated storage and calculation, with the intention of breaking through the “memory wall.” Zhang Xiaorong, director of the Deepin Science and Technology Research Institute, recently told reporters that 2026 is regarded by the industry as the “first year of commercialization of end-side AI” and is expected to begin in 2027. The advantages of domestic end-side AI chip manufacturers are large markets, multiple scenarios, and flexibility in style of play. Future breakers will not only rely on innovative architectures such as 3D stacking to resolve power consumption and computing power conflicts, but also bind downstream applications more tightly and use scene depth in exchange for ecological depth to seize the opportunities for localization of end-side computing power.