The Fujian Provincial People's Government issued the “Fifteenth Five-Year Plan for the Development of Emerging Industries and Future Industries of Fujian Province”. Among them, it was mentioned that the focus is on Xiamen, Quanzhou, Fuzhou, and Putian to cultivate chip design, chip manufacturing with special processes, packaging testing, and component equipment support capabilities. Develop products such as high-performance AI system-level chips, autonomous driving chips, industrial control chips, etc., and actively integrate into the national AI chip layout. Steadily expand manufacturing capacity for products such as 12-inch wafers, power semiconductors, analog chips, etc., and promote large-scale and characteristic development. A sealing and testing industry system covering advanced sealing and testing and traditional sealing and testing is built around chip requirements such as computing power, storage, display, and radio frequency. Improve supporting capabilities such as packaging substrates and imaging equipment.
Zhitongcaijing·08/27/2026 07:01:16
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The Fujian Provincial People's Government issued the “Fifteenth Five-Year Plan for the Development of Emerging Industries and Future Industries of Fujian Province”. Among them, it was mentioned that the focus is on Xiamen, Quanzhou, Fuzhou, and Putian to cultivate chip design, chip manufacturing with special processes, packaging testing, and component equipment support capabilities. Develop products such as high-performance AI system-level chips, autonomous driving chips, industrial control chips, etc., and actively integrate into the national AI chip layout. Steadily expand manufacturing capacity for products such as 12-inch wafers, power semiconductors, analog chips, etc., and promote large-scale and characteristic development. A sealing and testing industry system covering advanced sealing and testing and traditional sealing and testing is built around chip requirements such as computing power, storage, display, and radio frequency. Improve supporting capabilities such as packaging substrates and imaging equipment.