SK Hynix held a groundbreaking ceremony for its advanced memory packaging plant in Indiana on Thursday. This is a milestone in the US government's large-scale action to rebuild local supply chains and manufacturing in key strategic areas. With a total investment of over $4 billion and an area of 133.5 acres, the West Lafayette plant will become SK Hynix's first high-bandwidth memory packaging site in the US. Guo Luzheng, CEO of the company, said at the ceremony that the factory clean room is expected to be put into use in October 2028, and mass production of the next generation of high-bandwidth memory is scheduled to begin in the second half of 2029. He said that once the factory is fully put into operation, it will become an important high-bandwidth memory production center and can employ around 1,000 employees.

SK Hynix held a groundbreaking ceremony for its advanced memory packaging plant in Indiana on Thursday. This is a milestone in the US government's large-scale action to rebuild local supply chains and manufacturing in key strategic areas. With a total investment of over $4 billion and an area of 133.5 acres, the West Lafayette plant will become SK Hynix's first high-bandwidth memory packaging site in the US. Guo Luzheng, CEO of the company, said at the ceremony that the factory clean room is expected to be put into use in October 2028, and mass production of the next generation of high-bandwidth memory is scheduled to begin in the second half of 2029. He said that once the factory is fully put into operation, it will become an important high-bandwidth memory production center and can employ around 1,000 employees.