The paper used Kirin 2026 measured data to respond to questions about the cooling of 3D stacked chips. According to the data, transistor density increased by about 55%, but NPU and GPU power consumption decreased by 66% and 58%, respectively, under the same performance. He Tingbo believes that by shortening the signal transmission path and reducing energy consumption for data handling, LogicFolding enables the chips to be “piled up more densely” while reducing power consumption. It also makes the “chip should have overheated and burned down,” which the outside world is concerned about, not become a reality.

The paper used Kirin 2026 measured data to respond to questions about the cooling of 3D stacked chips. According to the data, transistor density increased by about 55%, but NPU and GPU power consumption decreased by 66% and 58%, respectively, under the same performance. He Tingbo believes that by shortening the signal transmission path and reducing energy consumption for data handling, LogicFolding enables the chips to be “piled up more densely” while reducing power consumption. It also makes the “chip should have overheated and burned down,” which the outside world is concerned about, not become a reality.