On September 8, Dutch lithography machine manufacturer Asmack and TSMC announced the establishment of an industry cooperation plan to promote the upgrade of high-numerical aperture extreme UV lithography masks from the current 6 inch to 12 inch to improve fab production efficiency, reduce chip manufacturing costs, and eliminate splicing restrictions. The two sides plan to establish a 12-inch mask trial production line in 2031 and push the 12-inch high-NA EUV lithography system into mass production with advanced manufacturing processes in 2033. TSMC expects to use ASML high NA technology in large-scale production of advanced processes starting in 2030.

On September 8, Dutch lithography machine manufacturer Asmack and TSMC announced the establishment of an industry cooperation plan to promote the upgrade of high-numerical aperture extreme UV lithography masks from the current 6 inch to 12 inch to improve fab production efficiency, reduce chip manufacturing costs, and eliminate splicing restrictions. The two sides plan to establish a 12-inch mask trial production line in 2031 and push the 12-inch high-NA EUV lithography system into mass production with advanced manufacturing processes in 2033. TSMC expects to use ASML high NA technology in large-scale production of advanced processes starting in 2030.