On September 8, Intel Foundry and Asmat announced that the two sides are continuing to promote mass production and application of high-numerical aperture extreme ultraviolet lithography technology. Intel has now processed more than 1 million wafers through early equipment certification, R&D, and some mass production processes, and high-NA EUV has been used in mass production of part of the Intel Core Ultra 3 series processor “Panther Lake”. Intel said that the performance of Intel 18A process products using high NA EUV reaches or exceeds similar layers using traditional 0.33 numerical aperture EUV lithography platforms. The two sides will also continue to promote the transition from the current 6-inch mask to the 6×12 inch large-size mask, and at the same time, through mask splicing technology, customers can obtain some of the advantages of high NA EUV under existing 6-inch mask conditions.

On September 8, Intel Foundry and Asmat announced that the two sides are continuing to promote mass production and application of high-numerical aperture extreme ultraviolet lithography technology. Intel has now processed more than 1 million wafers through early equipment certification, R&D, and some mass production processes, and high-NA EUV has been used in mass production of part of the Intel Core Ultra 3 series processor “Panther Lake”. Intel said that the performance of Intel 18A process products using high NA EUV reaches or exceeds similar layers using traditional 0.33 numerical aperture EUV lithography platforms. The two sides will also continue to promote the transition from the current 6-inch mask to the 6×12 inch large-size mask, and at the same time, through mask splicing technology, customers can obtain some of the advantages of high NA EUV under existing 6-inch mask conditions.