According to information from the State Intellectual Property Office, the patent application for the invention of Sirui New Materials “a metal fund diamond composite radiator and its preparation method” was made public on September 8, with publication number CN122719451A. According to the announcement, the application is a metal-based diamond composite radiator and its preparation method. The method includes: obtaining a bottom plate based on diamond particle preparation; superposition and assembling the bottom plate with a pre-prepared transition metal layer blank to obtain a composite substrate after hot pressing sintering; and preparing a flow channel layer through additive manufacturing on the surface of the transition metal layer of the composite substrate to obtain a radiator. The present application achieves efficient thermal conductivity through a diamond composite base plate, uses a transition metal layer to reduce thermal expansion mismatch stress, ensure interface service reliability, and further combines the 3D printed flow channel layer to achieve free molding of complex three-dimensional flow channel structures, thereby achieving comprehensive technical effects of high thermal conductivity, high interface reliability, and high flow channel design freedom.

According to information from the State Intellectual Property Office, the patent application for the invention of Sirui New Materials “a metal fund diamond composite radiator and its preparation method” was made public on September 8, with publication number CN122719451A. According to the announcement, the application is a metal-based diamond composite radiator and its preparation method. The method includes: obtaining a bottom plate based on diamond particle preparation; superposition and assembling the bottom plate with a pre-prepared transition metal layer blank to obtain a composite substrate after hot pressing sintering; and preparing a flow channel layer through additive manufacturing on the surface of the transition metal layer of the composite substrate to obtain a radiator. The present application achieves efficient thermal conductivity through a diamond composite base plate, uses a transition metal layer to reduce thermal expansion mismatch stress, ensure interface service reliability, and further combines the 3D printed flow channel layer to achieve free molding of complex three-dimensional flow channel structures, thereby achieving comprehensive technical effects of high thermal conductivity, high interface reliability, and high flow channel design freedom.