Shenzhen Technology (000021.SZ) plans to expand high-end memory chip packaging and testing production capacity projects with a total investment of 1.85 billion yuan

Zhitong Finance App News, Shenzhen Technology (000021.SZ) announced that in order to seize advanced packaging development opportunities brought about by the explosive growth of the AI industry, meet the needs of strategic customers, and break through key core advanced packaging technologies and existing production capacity bottlenecks, the company's wholly-owned subsidiary Peyton Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Shenzhen Peiton”) plans to further implement high-end memory chip packaging and testing capacity expansion projects. The total investment of the project is 1.85 billion yuan. First, it is planned to invest 1.22 billion yuan to establish a new wholly-owned subsidiary to build a new plant, which can carry 90,000 pieces/month of traditional packaging and 10,000 pieces/month of 2.5D advanced packaging; second, it is planned to invest 630 million yuan to build a 2.5D/3DS advanced packaging R&D line, which is expected to increase 2.5D/3DS advanced packaging production capacity by 100 pieces/month each after completion and delivery.