“The reservation was late this year, so we can only choose a small booth to display some model products.” An exhibitor lamented to the Securities Times reporter. On September 9, the 27th China International Optoelectronics Expo opened at the Shenzhen International Convention and Exhibition Center. IICIE International Integrated Circuit Innovation Expo and elexcon Shenzhen International Electronics Fair were held at the same time. More than 5,000 companies participated this year, covering everything from upstream basic materials to downstream terminal applications, and showcased the full link solution of “silicon optical chip manufacturing - CPO packaging integration - high-speed optical interconnection deployment”. Recently, A-share optical modules have experienced a wave of pullback and rebound. Attention to the industry summit has not abated. The exhibition site is full of crowds, popular exhibits have to be watched out, and recruitment notices have been posted at many booths. The current evolution of optical module technology is divided into two main lines: one is the continuous iteration of pluggable solutions, upgrading from 1.6T to 3.2T; the other is the industry's pursuit of reducing power consumption and improving integration, and Nvidia is driving CPO from technical verification to industrialization. However, in terms of the industrial implementation path, NPO is regarded as a short-term transition plan with higher certainty. With the gradual batch shipment of 800G optical modules, the main products exhibited by leading optical communication companies at this year's optical expo became 1.6T or higher transmission rate products. In addition, NPO programs were showcased intensively. Some NPO products from some manufacturers have completed the customer sample delivery and verification stage, and have also become the focus of attention of exhibitors at the exhibition site. At the same time, optical communication and semiconductor manufacturers are also increasing their layout in the field of upstream optical chips.

“The reservation was late this year, so we can only choose a small booth to display some model products.” An exhibitor lamented to the Securities Times reporter. On September 9, the 27th China International Optoelectronics Expo opened at the Shenzhen International Convention and Exhibition Center. IICIE International Integrated Circuit Innovation Expo and elexcon Shenzhen International Electronics Fair were held at the same time. More than 5,000 companies participated this year, covering everything from upstream basic materials to downstream terminal applications, and showcased the full link solution of “silicon optical chip manufacturing - CPO packaging integration - high-speed optical interconnection deployment”. Recently, A-share optical modules have experienced a wave of pullback and rebound. Attention to the industry summit has not abated. The exhibition site is full of crowds, popular exhibits have to be watched out, and recruitment notices have been posted at many booths. The current evolution of optical module technology is divided into two main lines: one is the continuous iteration of pluggable solutions, upgrading from 1.6T to 3.2T; the other is the industry's pursuit of reducing power consumption and improving integration, and Nvidia is driving CPO from technical verification to industrialization. However, in terms of the industrial implementation path, NPO is regarded as a short-term transition plan with higher certainty. With the gradual batch shipment of 800G optical modules, the main products exhibited by leading optical communication companies at this year's optical expo became 1.6T or higher transmission rate products. In addition, NPO programs were showcased intensively. Some NPO products from some manufacturers have completed the customer sample delivery and verification stage, and have also become the focus of attention of exhibitors at the exhibition site. At the same time, optical communication and semiconductor manufacturers are also increasing their layout in the field of upstream optical chips.