At the semi-annual results meeting on September 10, Wang Shunbo, chairman and general manager of Yongsi Electronics, explained that in the second half of 2026, the company will continue to adhere to the big customer strategy and focus on promoting the expansion, verification and product introduction of leading overseas customers and 2.5D advanced packaging customers on the basis of deepening cooperation with existing core customers. At the same time, the company will steadily advance the construction of advanced packaging product lines such as Bumping, wafer-level packaging, FC and 2.5D/3D, and continue to improve the “Bumping+CP+FC+FT” one-stop delivery capability.

At the semi-annual results meeting on September 10, Wang Shunbo, chairman and general manager of Yongsi Electronics, explained that in the second half of 2026, the company will continue to adhere to the big customer strategy and focus on promoting the expansion, verification and product introduction of leading overseas customers and 2.5D advanced packaging customers on the basis of deepening cooperation with existing core customers. At the same time, the company will steadily advance the construction of advanced packaging product lines such as Bumping, wafer-level packaging, FC and 2.5D/3D, and continue to improve the “Bumping+CP+FC+FT” one-stop delivery capability.