Ruisheng Technology (02018) first exhibition of CPO microlens array light expo, expected to be mass-produced in 2027

Zhitong Finance App learned that on September 9, AAC Ruisheng Technology (02018) first exhibited CPO high-precision microlens array (MLA) series products based on WLG's wafer-level glass molding process at the CIOE China Optical Expo. The products are aimed at the high-end optical communication market and are expected to be mass-produced in the second half of 2027.

CPO (Co-packaged Optics) is the next generation of high-speed interconnect technology for data centers. When traditional pluggable optical modules are iterated to 800G and 1.6T high speed, long-distance PCB wiring will cause technical bottlenecks such as high power consumption, high signal loss, and limited port density. The CPO co-packages the optical engine and switching chip to shorten electrical signal transmission from the centimeter level to the millimeter level, which can reduce port power consumption by 50%-65%, effectively improve bandwidth density, optimize transmission performance, and meet the high-speed interconnection requirements of large-scale AI computing power clusters. The architecture has strict requirements for optical coupling, advanced packaging, and thermal management, and the industry is rapidly moving towards large-scale commercialization.

Ruisheng developed its own WLG wafer-level glass molding technology and built a complete process system from high-precision mold development to wafer-level batch molding to solve the problem of mass production of high-precision glass array devices. On the one hand, this technology relies on ultra-high precision molds to form microstructures such as lens surface type, array spacing, and V-groove positioning at one time; on the other hand, glass molding replicates the nanoscale structure of the mold to ensure high consistency of array components and achieve standardized batch manufacturing.

The company has high-precision MLA mass production and development capabilities, and can achieve 0.35μm-0.5μm array spacing and lens surface accuracy within 200nm, meeting CPO multi-channel optical path high-precision alignment standards. Relying on the 4-inch wafer multi-hole synchronous molding process, compared with the traditional single processing mode, array elements can be formed simultaneously in batches, taking into account high precision indicators and batch stability, greatly improving efficiency and production. At the same time, the self-developed WLG device comes with a precise positioning structure, which can simplify the CPO light engine alignment process, reduce production processes, and reduce customer production costs.

At present, Ruisheng Technology's optical communication business has been commercialized in an orderly manner. The company has linked leading overseas optical communication and AI cloud connectivity chip companies to carry out joint research and development. Various customized CPO passive optical devices have completed technical verification and entered the customer sample delivery stage. The first-generation high-speed data center WLG passive optical devices are expected to be mass-produced in the second half of 2027.