According to industry insiders, in the era of customized high-bandwidth memory, Samsung Electronics' strategy for providing basic chips for its high-bandwidth memory is expected to change significantly. Instead of relying on its existing in-house foundry for independent production, the division will adopt a “dual-track manufacturing process” strategy, which also uses basic chips based on the TSMC process. Beginning with mass production of HBM4 this year, Samsung Electronics and SK Hynix have begun using an OEM process rather than traditional DRAM processes to manufacture substrates. Compared with the DRAM process, the advantage of the foundry process is that more functions can be integrated into the substrate, thereby improving performance and energy efficiency.

According to industry insiders, in the era of customized high-bandwidth memory, Samsung Electronics' strategy for providing basic chips for its high-bandwidth memory is expected to change significantly. Instead of relying on its existing in-house foundry for independent production, the division will adopt a “dual-track manufacturing process” strategy, which also uses basic chips based on the TSMC process. Beginning with mass production of HBM4 this year, Samsung Electronics and SK Hynix have begun using an OEM process rather than traditional DRAM processes to manufacture substrates. Compared with the DRAM process, the advantage of the foundry process is that more functions can be integrated into the substrate, thereby improving performance and energy efficiency.