According to CICC's research report, the popularity of the 27th Optical Expo increased unabated from previous years. More than 4,000 companies participated in the exhibition, and the overall number of visitors was nearly 190,000, an increase of 32% over the previous year. “Lock order” and “lock material” became the key words of the exhibition research, and demand certainty was further improved in 2027. In conjunction with exhibition research, the order schedule for some high-speed optical chip companies has been extended to 2028 and beyond, and the visibility of optical module orders covers 2027 and beyond; leading optical module manufacturers actively target core materials such as DSP, mSAP PCBs, and high-speed optical chips. Subsequent delivery differences are expected to depend more on key material guarantees, yield rates, and customer certifications, of which advanced process DSP may be the most critical link. It is expected that by 2028, after standards and engineering solutions gradually converge and yield rises, CPO may gradually scale up; OCS will move from private use by a few cloud vendors to more AI clusters, driving the decline of 2.4T light coherent applications; 400G per lane will drive device upgrades, and thin-film lithium niobate is expected to accelerate entry into customer verification and application windows.

According to CICC's research report, the popularity of the 27th Optical Expo increased unabated from previous years. More than 4,000 companies participated in the exhibition, and the overall number of visitors was nearly 190,000, an increase of 32% over the previous year. “Lock order” and “lock material” became the key words of the exhibition research, and demand certainty was further improved in 2027. In conjunction with exhibition research, the order schedule for some high-speed optical chip companies has been extended to 2028 and beyond, and the visibility of optical module orders covers 2027 and beyond; leading optical module manufacturers actively target core materials such as DSP, mSAP PCBs, and high-speed optical chips. Subsequent delivery differences are expected to depend more on key material guarantees, yield rates, and customer certifications, of which advanced process DSP may be the most critical link. It is expected that by 2028, after standards and engineering solutions gradually converge and yield rises, CPO may gradually scale up; OCS will move from private use by a few cloud vendors to more AI clusters, driving the decline of 2.4T light coherent applications; 400G per lane will drive device upgrades, and thin-film lithium niobate is expected to accelerate entry into customer verification and application windows.