Henggong Precision announced that the company plans to issue convertible corporate bonds to unspecified targets. The total capital raised will not exceed RMB 810 million. After deducting the issuance fee, it will be used for the self-contained intelligent robot body manufacturing project, the artificial intelligent robot pilot base, and the Shanghai R&D center project, etc., and to supplement the working capital. The issuance plan has been reviewed and approved by the board of directors, and still needs to be reviewed by the shareholders' meeting, reviewed by the Shenzhen Stock Exchange, and approved registration by the China Securities Regulatory Commission.

Henggong Precision announced that the company plans to issue convertible corporate bonds to unspecified targets. The total capital raised will not exceed RMB 810 million. After deducting the issuance fee, it will be used for the self-contained intelligent robot body manufacturing project, the artificial intelligent robot pilot base, and the Shanghai R&D center project, etc., and to supplement the working capital. The issuance plan has been reviewed and approved by the board of directors, and still needs to be reviewed by the shareholders' meeting, reviewed by the Shenzhen Stock Exchange, and approved registration by the China Securities Regulatory Commission.