IPO News | Xinde Semiconductor's Hong Kong Stock IPO and “Full Circulation” of Domestic Unlisted Shares Were Filed by the China Securities Regulatory Commission

The Zhitong Finance App learned that on September 18, the International Cooperation Department of the China Securities Regulatory Commission issued the “Notice on the “Full Circulation” of Overseas Issuance and Domestic Unlisted Shares of Jiangsu Xinde Semiconductor Technology Co., Ltd. The company intends to issue no more than 367,640,500 overseas listed common shares and list them on the Hong Kong Stock Exchange. The 51 shareholders of the company intend to convert their total holdings of 693,909,187 domestic unlisted shares into overseas listed shares and list them for circulation on the Hong Kong Stock Exchange.

According to the prospectus, Xinde Semiconductor is a semiconductor packaging and testing technology solution provider, mainly engaged in developing package design and providing customized packaging products and packaging product testing services. The company is one of the enterprises with advanced packaging technology capabilities in China. It can promote breakthroughs in semiconductor innovation technology in the “post-Moore era” and support the development wave of the “AI+ era”. Since its establishment in September 2020, Xinde Semiconductor has expanded the field of advanced packaging, accumulated experience in packaging technology, and has mass production capabilities for advanced packaging, covering QFN, BGA, LGA, WLP, and 2.5D/3D. The company is one of the few advanced packaging product providers in China to gather all of the above technical capabilities. The company has built a “Chip and Advanced Packaging Technology Platform (CapIC)” covering all technical branches in the field of advanced packaging to advance the company's technical knowledge and continue to develop technology.