The Zhitong Finance App learned that on Monday, Intel (INTC.US) opened with a sharp rise. As of press release, it was over 9%, and the increase in September had already exceeded 30%. According to the news, the media reported that Intel is extending its advanced packaging strategy to the field of micro LED substrates, and it is reported that it is developing in-depth cooperation with Youda Optoelectronics, a major panel manufacturer in Taiwan, to jointly promote CPO (Co-Packaging Optics) and high-density computing power chip integration solutions, indicating that the optoelectronic heterogeneous integration technology route is accelerating towards commercialization.

The Zhitong Finance App learned that on Monday, Intel (INTC.US) opened with a sharp rise. As of press release, it was over 9%, and the increase in September had already exceeded 30%. According to the news, the media reported that Intel is extending its advanced packaging strategy to the field of micro LED substrates, and it is reported that it is developing in-depth cooperation with Youda Optoelectronics, a major panel manufacturer in Taiwan, to jointly promote CPO (Co-Packaging Optics) and high-density computing power chip integration solutions, indicating that the optoelectronic heterogeneous integration technology route is accelerating towards commercialization.