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Some investors asked Aisen Co., Ltd. According to a blog post published by Jibang Consulting on May 19, based on information revealed by German equipment company SCHMID, TSMC is promoting panel-level CoPos packaging, with a key specification of 310 x 310 mm, and evaluating the integration of glass materials at the same size.

Zhitongcaijing·09/22/2026 08:49:05
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Some investors asked Aisen Co., Ltd. According to a blog post published by Jibang Consulting on May 19, based on information revealed by German equipment company SCHMID, TSMC is promoting panel-level CoPos packaging, with a key specification of 310 x 310 mm, and evaluating the integration of glass materials at the same size.