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LG Electronics partners with SK Enmove to develop next-generation cooling materials for AI data centers

PUBT·09/23/2026 01:05:08
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LG Electronics partners with SK Enmove to develop next-generation cooling materials for AI data centers
  • LG Corp. unit LG Electronics signed an MOU with SK Enmove to co-develop next-generation thermal-management materials for AI data centers.
  • Scope covers new refrigerants, compressor lubricants, immersion-cooling fluids, targeting tighter environmental rules plus higher cooling efficiency.
  • Parties will develop PFAS-free refrigerants with GWP below 150, aiming to meet emerging US, European requirements.
  • Collaboration expands existing immersion-cooling work, evaluating applications beyond data centers such as energy storage systems, EV components.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. LG Corp. published the original content used to generate this news brief on September 23, 2026, and is solely responsible for the information contained therein.