Toppan Global Venture Partners invests in semiconductor connectivity startup Eliyan in private funding round

• Toppan Global Venture Partners invested in Eliyan in a private financing round, backing its semiconductor connectivity technology for AI computing systems.
• Eliyan develops high-performance, power-efficient interconnects for chiplet-based architectures, targeting die-to-die and die-to-memory links in AI and HPC.
• Its NuLink PHY supports UCIe and BoW standards, designed to run on advanced packaging or conventional organic substrates to lower packaging complexity.
• Eliyan cited silicon validation of NuLink 2.0 on 3 nm, demonstrating 64 Gbps per bump while retaining UCIe compatibility.
• The company is extending its roadmap from in-package links toward chip-to-chip connectivity, with longer-term plans for electro-optical interconnects.

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