The surge in demand for artificial intelligence chips has also benefited Samsung Electronics' foundry business. Currently, AI chip production capacity is highly concentrated in TSMC, and more and more customers are seeking to distribute orders to help Samsung Electronics maintain the second place in the global foundry market. Market research firm Counterpoint released data on the 30th. In the second quarter of this year, Samsung Electronics accounted for about 4% of the global foundry market, second only to TSMC. The company's 4 nm and 5 nm processes are in strong demand, and the price of superimposed wafers has increased, supporting this performance. However, the gap between Samsung and TSMC is still huge. TSMC's second-quarter revenue was US$40.2 billion, up 34% year over year, accounting for about 42% of the total OEM 2.0 market. Counterpoint said that Samsung Electronics and Intel are taking orders from customers looking for alternative suppliers, but it is still difficult for the two to replace TSMC in terms of advanced process production capacity, yield, and advanced packaging capabilities. The competitive focus of the industry is expected to expand from wafer manufacturing to the field of advanced packaging. Counterpoint predicts that the OEM 2.0 market will maintain double-digit growth in the second half of the year, and packaging, substrate and test production capacity will become a key variable in expanding the supply of AI chips.

The surge in demand for artificial intelligence chips has also benefited Samsung Electronics' foundry business. Currently, AI chip production capacity is highly concentrated in TSMC, and more and more customers are seeking to distribute orders to help Samsung Electronics maintain the second place in the global foundry market. Market research firm Counterpoint released data on the 30th. In the second quarter of this year, Samsung Electronics accounted for about 4% of the global foundry market, second only to TSMC. The company's 4 nm and 5 nm processes are in strong demand, and the price of superimposed wafers has increased, supporting this performance. However, the gap between Samsung and TSMC is still huge. TSMC's second-quarter revenue was US$40.2 billion, up 34% year over year, accounting for about 42% of the total OEM 2.0 market. Counterpoint said that Samsung Electronics and Intel are taking orders from customers looking for alternative suppliers, but it is still difficult for the two to replace TSMC in terms of advanced process production capacity, yield, and advanced packaging capabilities. The competitive focus of the industry is expected to expand from wafer manufacturing to the field of advanced packaging. Counterpoint predicts that the OEM 2.0 market will maintain double-digit growth in the second half of the year, and packaging, substrate and test production capacity will become a key variable in expanding the supply of AI chips.