At the 2026 Kirin media conference, Xu Songyu, head of the wireless terminal chip product management department of Huawei's semiconductor business, first announced the detailed architecture diagram of the Kirin 9050 Pro logically-folding chip, including next-generation Lingxi CPU, Ma Liang GPU, Da Vinci architecture NPU, Kirin AI ISP, Balong AI Modem, FFTS function stream task scheduler, audio and video processor, security processor, and Lingxi micro-core working together. Xu Songyu revealed that the next Kirin 2027 chip is also ready. So far, all test results have met expectations, so the evolution is sustainable over the next 10 years. As for the specific stage, what kind of technology is required for each point may need to be gradually developed and discussed.

At the 2026 Kirin media conference, Xu Songyu, head of the wireless terminal chip product management department of Huawei's semiconductor business, first announced the detailed architecture diagram of the Kirin 9050 Pro logically-folding chip, including next-generation Lingxi CPU, Ma Liang GPU, Da Vinci architecture NPU, Kirin AI ISP, Balong AI Modem, FFTS function stream task scheduler, audio and video processor, security processor, and Lingxi micro-core working together. Xu Songyu revealed that the next Kirin 2027 chip is also ready. So far, all test results have met expectations, so the evolution is sustainable over the next 10 years. As for the specific stage, what kind of technology is required for each point may need to be gradually developed and discussed.