On October 12, at the 26th China International Industry Fair Integrated Circuit Exhibition, Shenghe Jingwei officially unveiled the self-developed SmartPoser® -BD high-performance computing packaging technology platform based on silicon bridge interconnect technology, and announced that the 2.5D silicon bridge technology with a single package size of 6 times the mask has completed phased verification and has the ability to undertake customer product introduction and verification.

On October 12, at the 26th China International Industry Fair Integrated Circuit Exhibition, Shenghe Jingwei officially unveiled the self-developed SmartPoser® -BD high-performance computing packaging technology platform based on silicon bridge interconnect technology, and announced that the 2.5D silicon bridge technology with a single package size of 6 times the mask has completed phased verification and has the ability to undertake customer product introduction and verification.