On October 15, interconnect chip vendor Zhongxingwei held a strategic cooperation signing ceremony in Wuxi to announce collaboration with industry partners such as Kirin, Tongxin, Tencent Cloud, Inspur, Xinhu3, ZTE, and Lenovo, focusing on product adaptation, joint verification and application deployment. According to reports, the application of Zhongxin's micro products has covered scenarios such as the Internet, finance, operators, electricity and energy. The signing of this agreement will further link chip development with the application of the whole machine, and promote joint adaptation and system optimization.

On October 15, interconnect chip vendor Zhongxingwei held a strategic cooperation signing ceremony in Wuxi to announce collaboration with industry partners such as Kirin, Tongxin, Tencent Cloud, Inspur, Xinhu3, ZTE, and Lenovo, focusing on product adaptation, joint verification and application deployment. According to reports, the application of Zhongxin's micro products has covered scenarios such as the Internet, finance, operators, electricity and energy. The signing of this agreement will further link chip development with the application of the whole machine, and promote joint adaptation and system optimization.