-+ 0.00%
-+ 0.00%
-+ 0.00%

On November 2, high-speed interconnect chip manufacturer Yitai Intelligent Technology Co., Ltd. announced the completion of Series A financing of over 200 million yuan. The A3 round was led by Tin Venture Capital, followed by Gold Investment Zhiyuan and Hongshan Capital. According to the company, this round of financing will be used for mass production and delivery of end-side switching chips and the continuous construction of a top talent pool to enter the first tier of domestic high-speed interconnect chips.

Zhitongcaijing·11/02/2026 02:33:08
Listen to the news
On November 2, high-speed interconnect chip manufacturer Yitai Intelligent Technology Co., Ltd. announced the completion of Series A financing of over 200 million yuan. The A3 round was led by Tin Venture Capital, followed by Gold Investment Zhiyuan and Hongshan Capital. According to the company, this round of financing will be used for mass production and delivery of end-side switching chips and the continuous construction of a top talent pool to enter the first tier of domestic high-speed interconnect chips.