Telford Technology announced that its wholly-owned subsidiary Telford Sales signed a “Letter of Intent for High-end Copper Foil Cooperation” with leading domestic CCL companies. The agreement stipulates that Telford Sales will supply high-end electronic circuit copper foil products such as RTF1-4 and HVLP1-4 to meet minimum quantity requirements in 2026. This agreement is a contract for the daily operation of the company and does not constitute a related transaction or major asset restructuring. If the agreement is successfully implemented, it is expected to have a positive impact on the company's 2026 business performance.

Telford Technology announced that its wholly-owned subsidiary Telford Sales signed a “Letter of Intent for High-end Copper Foil Cooperation” with leading domestic CCL companies. The agreement stipulates that Telford Sales will supply high-end electronic circuit copper foil products such as RTF1-4 and HVLP1-4 to meet minimum quantity requirements in 2026. This agreement is a contract for the daily operation of the company and does not constitute a related transaction or major asset restructuring. If the agreement is successfully implemented, it is expected to have a positive impact on the company's 2026 business performance.