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HyperLight, United Microelectronics, And Wavetek Microelectronics Partner For High-Volume Foundry Production Of HyperLight's TFLN Chiplet Platform On Both 6-Inch And 8-Inch Wafers

Benzinga·03/11/2026 18:06:11
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HyperLight Corporation ("HyperLight"), United Microelectronics Corporation (NYSE:UMC, TWSE: 2303)))("UMC"), and Wavetek Microelectronics Corporation ("Wavetek"), a wholly owned subsidiary of UMC, today announced a strategic manufacturing partnership for high-volume foundry production of HyperLight's TFLN (thin-film lithium niobate) Chiplet™ Platform on both 6-inch and 8-inch wafers. The collaboration marks a major inflection point in the commercialization of TFLN photonics, enabling the manufacturing capacity required for AI and cloud infrastructure deployment at scale.

Designed from inception to enable AI-infrastructure-scale production, the TFLN Chiplet™ Platform unifies the requirements of short-reach IMDD-based data center pluggables, longer-reach coherent-based datacom and telecom modules, and co-packaged optics (CPO) within a single high-volume manufacturable architecture. HyperLight serves as the platform architect, while UMC and Wavetek provide the high-volume foundry manufacturing infrastructure required for global deployment.